CMOS imager technology shrinks and image performance

Howard E. Rhodes, G. Agranov, C. Hong, U. Boettiger, R. Mauritzson, John Ladd, I. Karasev, Jeff A. Mckee, E. Jenkins, W. Quinlin, Inna Patrick, Jian Li, Xiaofeng Fan, R. Panicacci, S. Smith, Chandra Mouli, J. Bruce
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引用次数: 60

Abstract

In this paper, we present a performance summary of CMOS imager pixels from 5.2 /spl mu/m to 4.2 /spl mu/m using 0.18 /spl mu/m imager design rules, then to 3.2 /spl mu/m using 0.15 /spl mu/m imager design rules. These pixels support 1.3-megapixel, 2.0-megapixel, and 3.1-megapixel CMOS image sensors for digital still cameral (DSC) applications at 3.3 V, respectively. The 4TC pixels are all based on technology shrinks of Micron's 2P3M imager process, and each of the technology nodes report excellent CMOS imager low-noise, high-sensitivity, low-lag, and low-light performance, matching that of state-of-the-art charged-coupled device (CCD) imagers. We have put a model in place to provide the predictive performance of smaller pixels, and then use that model to discuss performance expectations down to 2.0 /spl mu/m pixels. With the combination of imager design rules, pixel architecture, and process technology tailored for CMOS imagers, we see no fundamental reason that CMOS imagers should not be able to continue matching CCD performance as pixel sizes shrink.
CMOS成像技术缩小图像性能
在本文中,我们给出了CMOS成像仪像素的性能总结,从5.2 /spl mu/m到4.2 /spl mu/m,使用0.18 /spl mu/m成像仪设计规则,然后使用0.15 /spl mu/m成像仪设计规则,到3.2 /spl mu/m。这些像素分别支持130万像素、200万像素和310万像素的CMOS图像传感器,用于数字静止相机(DSC)应用,电压为3.3 V。4TC像素都是基于美光2P3M成像仪工艺的技术缩小,每个技术节点都报告了出色的CMOS成像仪低噪声、高灵敏度、低滞后和低光性能,与最先进的电荷耦合器件(CCD)成像仪相匹配。我们已经建立了一个模型来提供较小像素的预测性能,然后使用该模型来讨论低于2.0 /spl mu/m像素的性能期望。结合成像仪的设计规则、像素架构和为CMOS成像仪量身定制的工艺技术,我们认为随着像素尺寸的缩小,CMOS成像仪不应该无法继续匹配CCD性能的根本原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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