High performance dual-gate FD-SOI CMOS process with an ultra thin TiSi/sub 2/

I. Nakamura, K. Imai, H. Onishi, K. Kumagai, T. Yamada, K. Iwaki, Y. Matsubara, T. Ishigami, S. Furosawa, T. Horiuchi
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引用次数: 1

Abstract

Summary form only given. We have developed a manufacturable FD-SOI 0.35 /spl mu/m CMOS process with an ultra thin TiSi/sub 2/ film. We obtained sheet resistance of 10 /spl Omega//sq. for N/sup +/ and P/sup +/ SOI diffusions, and saturation current of 1.8 mA and 0.56 mA for NMOS and PMOS transistors (V/sub D/=V/sub G/=1.5 V, W=10 /spl mu/m), respectively. The feasibility of the process has been verified successfully by fabricating a 128 kbit SRAM.
高性能双栅FD-SOI CMOS工艺,超薄TiSi/ sub2 /
只提供摘要形式。我们开发了一种可制造的FD-SOI 0.35 /spl mu/m CMOS工艺,具有超薄TiSi/ sub2 /薄膜。我们得到的板材电阻为10 /spl ω //sq。对于N/sup +/和P/sup +/ SOI扩散,NMOS和PMOS晶体管的饱和电流分别为1.8 mA和0.56 mA (V/sub D/=V/sub G/=1.5 V, W=10 /spl mu/m)。通过制作一个128 kbit SRAM成功验证了该工艺的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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