Half-conductive coupling interconnection technology for digital transmission between CMOS chips

Abstract

This paper describes for the first time how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chipped standard CMOS chips. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Due to shielding effects, the technology promises ultra-high-density interconnections.