Demonstration of OSAT compatible 300 mm through Si interposer

Abstract

We demonstrated fine pitch TSV interposer (TSI) with OSAT-only infra-structure. This provides an alternative commercial worth technology path given that OSAT can also offer a turnkey solution making 300 mm fine pitch TSV interposer. A comprehensive fabrication and characterization has been presented for process modules, integration, and fabricated interposers.