Characterization of anodic bondable LTCC for wafer-level packaging

Xiaodong Hu, Manuel Bäuscher, P. Mackowiak, Yucheng Zhang, O. Hoelck, H. Walter, M. Ihle, S. Ziesche, U. Hansen, S. Maus, O. Gyenge, B. Mukhopadhyay, O. Ehrmann, K. Lang, H. Ngo
{"title":"Characterization of anodic bondable LTCC for wafer-level packaging","authors":"Xiaodong Hu, Manuel Bäuscher, P. Mackowiak, Yucheng Zhang, O. Hoelck, H. Walter, M. Ihle, S. Ziesche, U. Hansen, S. Maus, O. Gyenge, B. Mukhopadhyay, O. Ehrmann, K. Lang, H. Ngo","doi":"10.1109/EPTC.2016.7861529","DOIUrl":null,"url":null,"abstract":"This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to LTCC and silicon with a thin aluminum layer bonded to LTCC and compares both with anodic bonding of standard Borofloat 33® from Schott GmbH to silicon. The result of this work provides a comprehensive overview of bonding parameters for the materials Borofloat 33® and LTCC. An inspection of the bonding quality is carried out, which includes the optical inspection of the bonded area and interface observation via a scanning electron microscope (SEM). The bonding quality is also shown with the charge transfer during the bonding process. This paper can be used to achieve a higher degree of freedom in the design of hermetic wafer level packaging for various Micro-Electro-Mechanical System(MEMS) devices made of glass and ceramic materials.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861529","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to LTCC and silicon with a thin aluminum layer bonded to LTCC and compares both with anodic bonding of standard Borofloat 33® from Schott GmbH to silicon. The result of this work provides a comprehensive overview of bonding parameters for the materials Borofloat 33® and LTCC. An inspection of the bonding quality is carried out, which includes the optical inspection of the bonded area and interface observation via a scanning electron microscope (SEM). The bonding quality is also shown with the charge transfer during the bonding process. This paper can be used to achieve a higher degree of freedom in the design of hermetic wafer level packaging for various Micro-Electro-Mechanical System(MEMS) devices made of glass and ceramic materials.
晶圆级封装用阳极可粘合LTCC的表征
这项工作有助于阐明在不同的键合条件下,随着温度、电压和时间的变化,对弗劳恩霍夫IKTS低温共烧陶瓷(LTCC)材料可键合的影响。本文研究了与LTCC结合的硅和与LTCC结合的薄铝层硅,并将两者与Schott GmbH的标准Borofloat 33®与硅的阳极结合进行了比较。这项工作的结果提供了材料Borofloat 33®和LTCC的键合参数的全面概述。对粘接质量进行了检测,包括粘接区域的光学检测和扫描电子显微镜(SEM)的界面观察。键合质量还表现为键合过程中的电荷转移。本文可为各种玻璃和陶瓷材料的微机电系统(MEMS)器件的密封晶圆级封装设计提供更高的自由度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信