The 3D RESURF junction

Abstract

This paper reports a new device concept-the 3D RESURF junction, which is applicable to a large class of power devices which we term 3D power devices. The new class of devices features considerably superior breakdown performance compared to any lateral power devices reported to date and challenges the state-of-the art vertical devices such as the VDMOSFET. The 3D Double Gate devices also benefit by having a low on-resistance due to carrier modulation in the drift region. The 3D RESURF is demonstrated numerically through extensive, advanced 2-D and 3-D simulations.