A compact model of holding voltage for latch-up in epitaxial CMOS

Ming-Jer Chen, C. Hou, P. Tseng, R. Shiue, Hun-Shung Lee, Jyh-Huei Chen, J. Jeng, Yeh-Ning Jou
{"title":"A compact model of holding voltage for latch-up in epitaxial CMOS","authors":"Ming-Jer Chen, C. Hou, P. Tseng, R. Shiue, Hun-Shung Lee, Jyh-Huei Chen, J. Jeng, Yeh-Ning Jou","doi":"10.1109/RELPHY.1997.584284","DOIUrl":null,"url":null,"abstract":"From different fabrication processes down to 0.35 /spl mu/m feature size and from two-dimensional device simulation, the holding voltage V/sub H/ for latch-up in epitaxial CMOS is found to be proportional to the square root of the holding current I/sub H/, specially for V/sub H//spl ges/2 V, while for V/sub H/<2 V the V/sub H/ linearly follows the I/sub H/. A slight modification of existing physically-based analytical models is set up for reproduction of all the observed dependencies, valid for different epitaxial layer thicknesses (t/sub epi/) and different anode-to-cathode spacings (L), along with a self-consistent interpretation by exploring the role of the base pushout width (h). By incorporating a structure-oriented holding current formula to this modified model, a compact, closed-form expression for V/sub H/ is produced directly as a function of t/sub epi/ and L. The compact model can serve as the scaling law for the holding voltage down to 1 V. The potential application of the compact model to low voltage, low power CMOS integrated circuits for latchup free operation is also projected.","PeriodicalId":193458,"journal":{"name":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","volume":"898 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1997.584284","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

From different fabrication processes down to 0.35 /spl mu/m feature size and from two-dimensional device simulation, the holding voltage V/sub H/ for latch-up in epitaxial CMOS is found to be proportional to the square root of the holding current I/sub H/, specially for V/sub H//spl ges/2 V, while for V/sub H/<2 V the V/sub H/ linearly follows the I/sub H/. A slight modification of existing physically-based analytical models is set up for reproduction of all the observed dependencies, valid for different epitaxial layer thicknesses (t/sub epi/) and different anode-to-cathode spacings (L), along with a self-consistent interpretation by exploring the role of the base pushout width (h). By incorporating a structure-oriented holding current formula to this modified model, a compact, closed-form expression for V/sub H/ is produced directly as a function of t/sub epi/ and L. The compact model can serve as the scaling law for the holding voltage down to 1 V. The potential application of the compact model to low voltage, low power CMOS integrated circuits for latchup free operation is also projected.
外延CMOS锁存器保持电压的紧凑模型
从不同的制造工艺到0.35 /spl mu/m的特征尺寸和二维器件模拟,发现外延CMOS中锁存的保持电压V/sub H/与保持电流I/sub H/的平方根成正比,特别是对于V/sub H//spl ges/ 2v,而对于V/sub H/< 2v, V/sub H/线性跟随I/sub H/。对现有的基于物理的分析模型进行了轻微的修改,以重现所有观察到的依赖关系,适用于不同的外延层厚度(t/sub epi/)和不同的阳极-阴极间距(L),并通过探索基底推出宽度(h)的作用来进行自一致的解释。通过将面向结构的保持电流公式合并到这个修改的模型中,V/sub H/的封闭表达式是t/sub epi/和l的函数,紧凑的模型可以作为保持电压降至1v的标度律。展望了该模型在低电压、低功耗CMOS集成电路中的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信