The reliability performance evaluation of high-density thin-film multichip substrates

Abstract

For the DEC VAX-9000 computer, a high-density interconnect called the high density signal carrier was developed. The author describes the reliability performance evaluation of the high density signal carrier through the phases of the program from the early reliability prediction, through the subsequent reliability assessment and debugging and ongoing reliability testing, to the later analysis of the field reliability performance data. He also reviews and compares the mean time-between-failure (MTBF) design goals versus the actual field performance data over an 18-month period using various reliability assessment methods and techniques.<>