Advanced design for optical devices' thermal fluid coupling dissipating

Abstract

Commercial values of the relevant optical products are very potential in the future because more and more applications are successfully used in many fields. Currently, there several solutions are developing in Advanced Semiconductor Engineering of Chungli and Kaohsiung (ASE CL and KH), especially concentrating on the optical sensor and transceiver. Regarding the optical sensor transceiver, the edge-emitting laser (EEL) are commonly used as a light source of the single-mode fiber for a long-range network of optical fiber due to the low dispersion and long transmission distance. However, the Joule heat generation by the laser will cause the temperature to rise thereby affecting the laser output efficiency and quality, and will cause the position unable to be precisely allowed when EEL couples the optical components, which leads to low optical coupling efficiency and even affects the transmission quality of the fiber. The present research was mainly conducted by the finite element method (FEM) to study the influence of the substrate type, housing and dissipating materials on the thermal effect of EEL package structure. The numerical simulation results were adopted as the response surface method (RSM) to obtain the optimized design parameters for the heat dissipation solutions of the substrate, housing and dissipating materials in EEL package structure. The results showed that thermal conductivity variations of the substrate is a main influence factor to the response temperature of EEL optical package, but the influence on the response temperature is almost none when thermal conductivity greater than 85.15 W/mK. In addition, the present research obtained a significant design rule, which is able to seek out a suitable combination of materials within the required temperature range, and can be further controlled the costs and optimized the performance.