C. Maleville, E. Neyret, N. B. Mohamed, C. Maunand-Tussot, D. Delprat
{"title":"Nano-uniformity control in Unibond/sup /spl reg// process","authors":"C. Maleville, E. Neyret, N. B. Mohamed, C. Maunand-Tussot, D. Delprat","doi":"10.1109/SOI.2003.1242929","DOIUrl":null,"url":null,"abstract":"This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.","PeriodicalId":329294,"journal":{"name":"2003 IEEE International Conference on SOI","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 IEEE International Conference on SOI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.2003.1242929","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.
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