Recent advances in Anisotropic Conductive Adhesives (ACAs) technology: Materials and processing

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507831

Kyung W. Paik

引用次数: 1

Abstract

New ACA materials and processing technologies innovation have been made at various advanced packaging applications such as FOB, FOF, COF, COG, TSP (Touch Screen Panel) and 3D-TSV (Through Silicon Via) assemblies.

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各向异性导电胶粘剂(ACAs)技术的最新进展:材料和加工

在FOB, FOF, COF, COG, TSP(触摸屏面板)和3D-TSV(通硅孔)组件等各种先进封装应用中，新的ACA材料和加工技术进行了创新。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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