{"title":"Memory in the era of innovative architectures","authors":"Dean Klein","doi":"10.1109/VLSIT.2016.7573363","DOIUrl":null,"url":null,"abstract":"There is much buzz in the industry today about the “Post Moore's Law” state we are entering. Yet the opportunities for architectural innovation seem more prevalent than ever: 3D integration, advanced packaging solutions, specialized devices with specialized processes, new architectures and resiliency are just some areas of opportunity as we run out of an ability to scale in two dimensions.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2016.7573363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
There is much buzz in the industry today about the “Post Moore's Law” state we are entering. Yet the opportunities for architectural innovation seem more prevalent than ever: 3D integration, advanced packaging solutions, specialized devices with specialized processes, new architectures and resiliency are just some areas of opportunity as we run out of an ability to scale in two dimensions.