A comparative numerical simulation of a nanoscaled body on Insulator FinFET

A. Anwar, Imran Hossain
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引用次数: 7

Abstract

In this paper a FinFET structure with channel region insulated from body by buried oxide(Body Over Insulator) is proposed. Body Over Insulator (BOI) FinFET has advantage over both Silicon Over Insulator(SOI) and Bulk FinFETs. Here, a comparative numerical study of a BOI FinFET, a bulk FinFET and a SOI FinFET is presented. The result have shown that, the proposed BOI FinFET has better short channel effect(SCE) suppression and a lower threshold voltage than bulk FinFET. Better heat dissipation capability by virtue of a smaller insulation, ease of fabrication and acceptable SCE suppression makes this structure a viable competitor of the SOI structure.
在绝缘体FinFET上的纳米体比较数值模拟
本文提出了一种沟道区域用埋地氧化物(体过绝缘子)与体绝缘的FinFET结构。体上绝缘体(BOI) FinFET比硅上绝缘体(SOI)和体上FinFET都有优势。本文对BOI FinFET、bulk FinFET和SOI FinFET进行了数值比较研究。结果表明,所提出的BOI FinFET具有较好的短通道抑制效果和较低的阈值电压。凭借更小的绝缘,易于制造和可接受的SCE抑制,更好的散热能力使该结构成为SOI结构的可行竞争对手。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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