R1 — A reliability comparison study between 14 lead free alloys

Abstract

The reliability of solder joints is one important part of the quality of SMT-Boards. The paper presents a reliability study named R1. The base of the study is a reliability experiment with 14 different solder alloys (13 lead free solders and a Sn63 alloy as a reference), six different surfaces, six different SMD-chips combined with three different pad layouts. A high cycle reliability test was used. The times of failures were evaluated with the Weibull analysis followed by an analysis of variance.