SRAM bitcell design for low voltage operation in deep submicron technologies

Younghwi Yang, Jisu Kim, Hyun-Kook Park, Joseph Wang, G. Yeap, Seong-ook Jung
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引用次数: 2

Abstract

As technology scales down, an increasing number of transistors can be integrated into a single chip but process variation becomes more serious. SRAM is one of the key components in a SoC and it occupies a large portion of the SoC. Thus, the SRAM bitcell is typically designed using very small transistors for high integration, which limits the minimum operating voltage (VCCmin) of the SoC because of the large threshold voltage (Vth) mismatch between paired transistors caused by small feature size. As process technology scales down to sub-32nm technology, the 6T SRAM bitcell that is currently used may not achieve proper stability, write-ability, and read-ability at the required operating voltage. In this paper, several approaches are investigated to resolve the issue, such as upsized 6T SRAM bitcell, 8T SRAM bitcell, read- and write-preferred bitcells, and read- and write-assist circuits. HSPICE simulations are performed using PTM 32nm model parameters.
在深亚微米技术中用于低电压操作的SRAM位单元设计
随着技术的发展,越来越多的晶体管可以集成到单个芯片中,但工艺变化变得更加严重。SRAM是SoC的关键部件之一,占据SoC的很大一部分。因此,SRAM位单元通常使用非常小的晶体管来设计高集成度,这限制了SoC的最小工作电压(VCCmin),因为小特征尺寸导致成对晶体管之间的大阈值电压(Vth)不匹配。随着制程技术降至32nm以下,目前使用的6T SRAM位单元可能无法在所需的工作电压下实现适当的稳定性、可写性和可读性。本文研究了几种解决这一问题的方法,如放大6T SRAM位单元、8T SRAM位单元、读写首选位单元以及读写辅助电路。采用PTM 32nm模型参数进行HSPICE仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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