8-1 A TCAD Study on Mechanism and Countermeasure for Program Characteristics Degradation of 3D Semicircular Charge Trap Flash Memory

N. Kariya, M. Tsuda, T. Kurusu, M. Kondo, K. Nishitani, H. Tokuhira, J. Shimokawa, Y. Yokota, H. Tanimoto, S. Onoue, Y. Shimada, T. Kato, K. Hosotani, F. Arai, M. Fujiwara, Y. Uchiyama, K. Ohuchi
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引用次数: 1

Abstract

A TCAD model to simulate program/erase characteristics of 3D charge trap flash memory cells is constructed and calibrated with the experiment. The mechanism of the program characteristics degradation of the semicircular cells are studied using the TCAD model and it is clarified that the current leakage path due to the fringe parasitic transistor causes the degradation. An initial charge injection technique is proposed to suppress the parasitic leakage current to improve the program characteristics of the semicircular cells.
8-1三维半圆电荷阱闪存程序特性退化机理及对策的TCAD研究
建立了三维电荷阱快闪存储单元的编程/擦除特性的TCAD模型,并进行了实验标定。利用TCAD模型研究了半圆形电池程序特性退化的机理,明确了由条纹寄生晶体管引起的漏电流路径是导致程序特性退化的原因。提出了一种抑制寄生漏电流的初始电荷注入技术,以改善半圆形电池的程序特性。
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