Atomistic modeling of B activation and deactivation for ultra-shallow junction formation

M. Aboy, L. Pelaz, L. Marqués, J. Barbolla, A. Mokhberi, Y. Takamura, P. Griffin, J. Plummer
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引用次数: 1

Abstract

We have investigated the physical mechanisms for the B clustering formation and dissolution for ultra-shallow junction formation. We have analyzed high-dose low-energy B implants and theoretical structures with box-shaped B profiles that are fully active. These structures could be simplifications of the situation resulting from regrowth of preamorphized or laser annealed B implants. For these conditions, we have to take into account new effects due to the high B concentration and the proximity to the surface. The simulations show that the deactivation mechanism for B implants in crystalline Si takes place through a high interstitial content path, and it happens even for low B doses. The deactivation of the B box depends on the B concentration. In the absence of excess Si interstitials, B deactivation only happens for very high B concentrations. This process is very slow for low temperature anneals. If there is a residual concentration of Si interstitials along with the B box, the deactivation will take place rapidly even at low temperatures. In the model, the reactivation mechanism takes place in all cases through the low interstitial content path, by the capture of native Si interstitial defects and the emission of B interstitials.
超浅结形成中B活化和失活的原子模型
我们研究了B簇形成和超浅结形成的溶解的物理机制。我们已经分析了高剂量低能量的B植入物和具有完全活跃的箱形B轮廓的理论结构。这些结构可能是由于预非晶化或激光退火B植入物再生造成的情况的简化。对于这些条件,我们必须考虑由于高B浓度和接近表面而产生的新影响。模拟结果表明,B植入物在晶体Si中的失活机制是通过高间隙含量的路径进行的,即使在低剂量的B植入物中也会发生失活机制。B盒的失活取决于B的浓度。在没有过量Si间质的情况下,B的失活只发生在非常高的B浓度下。这个过程对于低温退火来说是非常缓慢的。如果与B盒一起存在残余浓度的Si间隙,则即使在低温下也会迅速失活。在该模型中,再激活机制在所有情况下都是通过低间隙含量路径,通过捕获天然Si间隙缺陷和发射B间隙来实现的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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