Performance of Thermal Enhancements in Chip on Flex

Abstract

The paper describes the development of encapsulated multiple chip on flex (COF) as Industry Common Building Blocks (CBB) as an economic alternative to high cost Application Specific Integrated Circuits (ASIC). Lockheed Martin/ General Electric developed the high density interconnect (HDI) structure used in these modules. The successful implementation of such CBB has been demonstrated in a F414 FADEC (Full Authority Digital Engine Control). The paper describes the construction of these COF CBB modules and their thermal performance with several thermal enhancement techniques.