Enhance Larger FCBGA Package Evaluation and Characterization

Abstract

In order to enable higher electrical performance for the application of networking, larger FCBGA package was been demanded to meet the electrical target. According to that, the package size usually has been kept to be large around 60mm x 60mm and die size has been larger than 20mm x 20mm in advance networking application. Normally, larger FCBGA package would result in increased semiconductor assembly processes and reliability challenges, such as die corner delam, solder mask crack, Cu post side wall delam, TIM coverage loss and warpage issue. Molded type FCBGA package would be a solution to reduce processes and reliability risk. Several Molded type FCBGA packages were proposed in this paper to check the level of stress and warpage performance compared to traditional EHS-FCBGA package. Regarding solder mask crack, ABF substrate structure will be the suggestion to avoid solder mask crack issue. According lots fundamental work, molded type FCBGA package combined ABF substrate could reduce package stress effectively and perform similar warpage with traditional EHS-FCBGA to be a solution to solve current larger FCBGA package processes and reliability issue.