Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications

Abstract

Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.