LSTM-based Analysis of Temporally- and Spatially-Correlated Signatures for Intermittent Fault Detection

Xingyi Wang, Li Jiang, K. Chakrabarty
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引用次数: 7

Abstract

Intermittent faults are a critical reliability threat in deep submicron VLSI circuits. These faults occur non-deterministically due to unstable hardware and unpredictable operating conditions; they are activated/deactivated with changes in the runtime environment. Online fault prediction models are commonly used to predict soft errors and aging effects. A small set of flip-flops, whose states constitute the signature, conveys information about the fine-grained behavior of the circuit, and serves as the input to a machine-learning (ML) model. The nondeterministic failure mechanisms of intermittent faults, however, result in temporally- and spatially-correlated signatures (TSC-signatures). Moreover, the high-dimensional time-series features impede the use of traditional ML models for intermittent-fault detection. To cope with this challenge, we adapt the TSC-signatures to existing ML detection models. Moreover, we propose a novel detection model based on Recurrent Neural Network with Long Short-Term Memory (LSTM) that is inherently suitable for this problem. Simulation results for the ITC99 benchmark circuits highlight the effectiveness of the proposed model.
基于lstm的间歇故障时空相关特征分析
在深亚微米VLSI电路中,间歇性故障是严重的可靠性威胁。由于硬件不稳定和不可预测的操作条件,这些故障发生的不确定性;它们随着运行时环境的变化而被激活/取消激活。在线故障预测模型通常用于预测软误差和老化效应。一小组触发器,其状态构成签名,传递有关电路细粒度行为的信息,并作为机器学习(ML)模型的输入。然而,间歇性故障的不确定性失效机制导致时间和空间相关特征(tsc -签名)。此外,高维时间序列特征阻碍了传统机器学习模型在间歇性故障检测中的应用。为了应对这一挑战,我们将tsc签名适应于现有的ML检测模型。此外,我们提出了一种新的基于长短期记忆递归神经网络(LSTM)的检测模型,该模型本质上适合于这一问题。ITC99基准电路的仿真结果表明了该模型的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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