Understanding charge traps for optimizing Si-passivated Ge nMOSFETs

P. Ren, R. Gao, Z. Ji, H. Arimura, J. F. Zhang, R. Wang, M. Duan, W. Zhang, J. Franco, S. Sioncke, D. Cott, J. Mitard, L. Witters, H. Mertens, B. Kaczer, A. Mocuta, N. Collaert, D. Linten, R. Huang, A. Thean, G. Groeseneken
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引用次数: 19

Abstract

For the first time, two different types of electron traps are clearly identified in Ge nFETs with Type-A controlled by the HfO2 layer thickness and Type-B by the Si growth induced Ge segregation. Only Type-B are responsible for mobility degradation and they do not saturate with stress time, while the opposite applies to Type A. A PBTI model is proposed and validated for the long term prediction.
了解优化硅钝化锗nmosfet的电荷陷阱
本文首次在Ge nfet中发现了两种不同类型的电子陷阱,其中a型由HfO2层厚度控制,b型由Si生长诱导的Ge偏析控制。只有b型对迁移率退化负责,且不随应力时间饱和,而A型则相反。提出了PBTI模型,并对其长期预测进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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