Novel miniaturized packaging for implantable electronic devices

Abstract

A novel biocompatible packaging process for implantable electronic systems is described, combining excellent biocompatibility and hermeticity with extreme miniaturization. Biocompatible and clean room compatible materials and integration processes are evaluated and selected for die encapsulation and interconnection. Cytotoxicity, diffusion tests and corrosion tests using DI water and more aggressive bio-fluids demonstrated promising performance of the packaging.