Trench depth optimization for energy efficient discrete power trench MOSFETs

O. Alatise, N. Parker-Allotey, M. Jennings, P. Mawby, I. Kennedy, G. Petkos
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Abstract

Power losses are investigated in trench MOSFETs as functions of trench depth and switching frequency. MOSFETs with different trench depths are fabricated and characterized. Measurements show that gate charge and capacitance increases with trench depth thereby increasing switching losses. However, conduction losses reduce with increasing trench depth because of higher gate-modulated accumulation charge at the drain. Since switching losses increase with frequency, the trade-off between the conduction and switching losses for different trench depths will be determined by the switching frequency. In conclusion, deep-trench MOSFETs outperform shallow-trench MOSFETs at low frequencies and become outperformed by the latter at high frequencies.
高能效分立功率沟槽mosfet的沟槽深度优化
研究了沟槽mosfet的功率损耗随沟槽深度和开关频率的变化规律。制备了不同沟槽深度的mosfet,并对其进行了表征。测量结果表明,栅极电荷和电容随着沟槽深度的增加而增加,从而增加了开关损耗。然而,随着沟槽深度的增加,由于漏极处栅极调制积累电荷的增加,导通损耗减小。由于开关损耗随频率增加而增加,因此不同沟槽深度的导通和开关损耗之间的权衡将由开关频率决定。总之,深沟mosfet在低频时优于浅沟mosfet,在高频时优于浅沟mosfet。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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