Reverse-Body Biasing for Radiation-Hard by Design Logic Gates

L. Clark, K.C. Mohr, K. Holbert
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引用次数: 9

Abstract

Different radiation hardening by design techniques for mitigating total ionizing dose (TID) effects in NMOS transistors are presented. NMOS annular layout transistors are compared to two-edge and hardened by reverse-body bias (RBB) with respect to CMOS gate area, delay, active and leakage power, and TID hardness. Accelerated testing using Co-60 irradiation of test structures on a 130 nm bulk CMOS process shows that RBB provides smaller devices and allows less chip-level leakage at 1 Mrad(Si) than a design hardened using annular gates has pre-irradiation. Simulations of fanout-of-four (FO4) two-input NAND gates show that RBB provides an energy-delay product (EDP) comparable to conventional two-edge gates. Different annular topologies have EDP 35% to over 350% greater
反体偏置辐射——难以设计逻辑门
提出了不同的辐射硬化设计技术,以减轻NMOS晶体管的总电离剂量效应。将NMOS环形布局晶体管与双面晶体管进行比较,并对CMOS栅极面积、延迟、有源和泄漏功率以及TID硬度进行反体偏置(RBB)硬化。在130 nm块体CMOS工艺上使用Co-60辐照测试结构的加速测试表明,RBB提供了更小的器件,并且在1 Mrad(Si)时允许更少的芯片级泄漏,比使用环形栅极进行预辐照的设计硬化。四扇通(FO4)双输入NAND门的仿真表明,RBB提供了与传统双边门相当的能量延迟积(EDP)。不同的环形拓扑结构的EDP要高出35%到350%以上
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