Undoped SiGe material calibration for numerical nanosecond laser annealing simulations

A. Royet, L. Dagault, S. Kerdilès, P. Alba, J. P. Barnes, Filadelfo Cristiano, Karim Huet
{"title":"Undoped SiGe material calibration for numerical nanosecond laser annealing simulations","authors":"A. Royet, L. Dagault, S. Kerdilès, P. Alba, J. P. Barnes, Filadelfo Cristiano, Karim Huet","doi":"10.23919/SISPAD49475.2020.9241664","DOIUrl":null,"url":null,"abstract":"Physical parameters calibration (dielectric and alloy properties) of Si$_{1-X}$Gex alloys is presented in order to simulate the Ultra Violet-Nanosecond Laser Annealing (UV-NLA) of this material for Si/ Si$_{1-X}$Gex based MOS devices. Optical and physical parameters are extracted and modeled from experimental characterizations for several Ge concentrations and then fitted to match experimental laser annealing results. A good prediction, in terms of melt depth and melting duration, is achieved for different Ge concentrations between 20 and 40%, usually encountered in Si$_{1-X}$Gex CMOS integration process.","PeriodicalId":206964,"journal":{"name":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/SISPAD49475.2020.9241664","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Physical parameters calibration (dielectric and alloy properties) of Si$_{1-X}$Gex alloys is presented in order to simulate the Ultra Violet-Nanosecond Laser Annealing (UV-NLA) of this material for Si/ Si$_{1-X}$Gex based MOS devices. Optical and physical parameters are extracted and modeled from experimental characterizations for several Ge concentrations and then fitted to match experimental laser annealing results. A good prediction, in terms of melt depth and melting duration, is achieved for different Ge concentrations between 20 and 40%, usually encountered in Si$_{1-X}$Gex CMOS integration process.
数值纳秒激光退火模拟的未掺杂SiGe材料标定
为了模拟Si/ Si$ {1-X}$Gex基MOS器件的紫外-纳秒激光退火(UV-NLA),提出了Si$ {1-X}$Gex合金的物理参数校准(介电性能和合金性能)。从实验表征中提取了几种锗浓度的光学和物理参数并建立了模型,然后进行拟合以匹配实验激光退火结果。在Si$ {1-X}$Gex CMOS集成工艺中,通常会遇到不同浓度的Ge,在20 ~ 40%之间,可以很好地预测熔体深度和熔体持续时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信