Recent trends of package warpage and measurement metrologies

W. K. Loh, R. Kulterman, H. Fu, M. Tsuriya
{"title":"Recent trends of package warpage and measurement metrologies","authors":"W. K. Loh, R. Kulterman, H. Fu, M. Tsuriya","doi":"10.1109/ICEP.2016.7486789","DOIUrl":null,"url":null,"abstract":"Current consumer products are designed based on an “outside in” process where parameters such as consumer experience and portability are prioritized to define the system and component design and performance targets. This drives innovation in electronic packaging to challenge the existing design boundaries and norms. One of the challenges faced by the electronic industry is managing the package warpage characteristics for seamless component to board assembly process. As part of a continuous effort, iNEMI has collaborated with individual companies to establish a sampling of current trends of electronic packaging warpage, and also initiated an effort to evaluate state-of-the-art dynamic warpage measurement metrologies. The former objective has provided a new batch of donated parts for warpage characterization which included Package on Package (PoP) memory, System in Package (SiP), Fine pitch Ball Grid Array (FBGA) as well as Flip Chip BGA (FCBGA) with and without a lid (heat spreader). The dynamic warpage metrologies considered were based on thermal shadow moiré, 3D digital image correlation (3D DIC), fringe projection moiré and confocal technique. In this paper, the majority of the work covered will be the dynamic warpage characteristics of donated components and a brief description of metrologies under consideration.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2016.7486789","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Current consumer products are designed based on an “outside in” process where parameters such as consumer experience and portability are prioritized to define the system and component design and performance targets. This drives innovation in electronic packaging to challenge the existing design boundaries and norms. One of the challenges faced by the electronic industry is managing the package warpage characteristics for seamless component to board assembly process. As part of a continuous effort, iNEMI has collaborated with individual companies to establish a sampling of current trends of electronic packaging warpage, and also initiated an effort to evaluate state-of-the-art dynamic warpage measurement metrologies. The former objective has provided a new batch of donated parts for warpage characterization which included Package on Package (PoP) memory, System in Package (SiP), Fine pitch Ball Grid Array (FBGA) as well as Flip Chip BGA (FCBGA) with and without a lid (heat spreader). The dynamic warpage metrologies considered were based on thermal shadow moiré, 3D digital image correlation (3D DIC), fringe projection moiré and confocal technique. In this paper, the majority of the work covered will be the dynamic warpage characteristics of donated components and a brief description of metrologies under consideration.
包装翘曲和测量计量的最新趋势
当前的消费类产品是基于“由外而内”的流程设计的,在该流程中,诸如消费者体验和可移植性等参数被优先考虑,以定义系统和组件设计以及性能目标。这推动了电子封装的创新,以挑战现有的设计边界和规范。电子行业面临的挑战之一是管理无缝组件到电路板组装过程中的封装翘曲特性。作为持续努力的一部分,iNEMI与个别公司合作,建立了电子封装翘曲的当前趋势抽样,并开始努力评估最先进的动态翘曲测量计量。前一目标提供了新一批用于翘曲表征的捐赠部件,包括包对包(PoP)存储器,包中系统(SiP),细间距球栅阵列(FBGA)以及带盖和不带盖(散热器)的倒装芯片BGA (FCBGA)。考虑的动态翘曲测量基于热阴影模型、三维数字图像相关(3D DIC)、条纹投影模型和共聚焦技术。在本文中,所涉及的大部分工作将是捐赠部件的动态翘曲特性和所考虑的计量的简要描述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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