Statistical analysis of capacitance coupling effects on delay and noise

U. Narasimha, Binu Abraham, N. Nagaraj
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引用次数: 11

Abstract

Statistical static timing analysis (SSTA) tools have mostly addressed the process variations of devices and lumped interconnect RC effects. This paper provides an overview of interconnect process variations of capacitive coupling and its effect on crosstalk delay and noise. The correlations among parallel plate, lateral and total capacitance is shown. Correlations between resistance and capacitance are illustrated to enable development of a simple and efficient model for delay and noise analysis. Experimental results are shown to validate the assumptions on the linearity of sensitivity of delay and noise to process variations. A methodology to account for process variations in crosstalk delay and noise is proposed
电容耦合对时延和噪声影响的统计分析
统计静态时序分析(SSTA)工具主要用于解决器件的过程变化和集总互连RC效应。本文综述了电容耦合互连过程的变化及其对串扰延迟和噪声的影响。给出了平行板电容、横向电容和总电容之间的相关关系。电阻和电容之间的相关性说明,使开发一个简单而有效的模型延迟和噪声分析。实验结果验证了延迟和噪声灵敏度随过程变化的线性假设。提出了一种考虑串扰延迟和噪声过程变化的方法
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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