Effect of electromigration on mechanical behavior of solder joints

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI:10.1109/ISAPM.2005.1432048

F. Ren, J. Nah, J. Suh, K. Tu, B. Xiong, L.H. Xu, J. Pang

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引用次数: 9

Abstract

The combination of electromigration effect and stress effect was investigated in lead free solder joints with a diameter of 300/spl mu/m. One dimensional structures, metal (wire)-solder (ball)-metal (wire) was developed. Mechanical force and current could be applied serially or simultaneously. The current density of electromigration was 1/spl sim/5/spl times/10/sup 3/ A/cm/sup 2/. The working temperature was 100-150/spl deg/C. Tensile test and shear test were taken before and after electromigration to make the comparison. The tensile strain rate was 3/spl mu/m/min. The experiment results show that, the samples broke at the middle of solder without applying current. However, after applying current of electromigration for 1 day, 2 days or longer, the failure always occurred at cathode interface. And the tensile strength was lower with longer electromigration time or higher current density. Shear test also illustrates the electromigration effect on mechanical property in composite solder joints.

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电迁移对焊点力学行为的影响

在直径为300/spl mu/m的无铅焊点上研究了电迁移效应和应力效应的结合。一维结构，金属(线)-焊料(球)-金属(线)。机械力和电流可串联或同时施加。电迁移电流密度为1/spl sim/5/spl times/10/sup 3/ A/cm/sup 2/。工作温度100-150℃/spl℃。通过电迁移前后的拉伸试验和剪切试验进行对比。拉伸应变速率为3/spl mu/m/min。实验结果表明，在不施加电流的情况下，试样在焊料中间断裂。然而，在施加电迁移电流1天、2天或更长时间后，阴极界面总是发生失效。随着电迁移时间的延长和电流密度的增大，合金的抗拉强度降低。剪切试验也说明了电迁移对复合焊点力学性能的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

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