Fine-grained polysilicon films with built-in tensile strain

M. O. Rahman, M. Ando
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引用次数: 1

Abstract

Polysilicon (P-Si) refers to the structure of the silicon crystals as they are applied to the glass substrate. Polysilicon crystals are larger, more regularly shaped and more uniformly oriented in comparison with amorphous silicon (A-Si) and thus polysilicon is the most widely used structural material in current microdevices that are manufactured by surface micro machining. Polysilicon film usually show s a compressive built-in strain field. Strain diagnostic structures are used to elucidate that polysilicon films with built-in tensile strain can be achieved. We have reported that Boron doping is an indirect method for strain measurement and lattice spacing changes can be modeled by (Delta) a equals a0 X (ri - rs/rs X (Ni/Ns) where ri and r2 can be regarded as a radius of impurities and silicon atoms and Ni and Ns are the concentration of impurities and silicon.
具有内置拉伸应变的细颗粒多晶硅薄膜
多晶硅(P-Si)是指应用于玻璃基板的硅晶体的结构。与非晶硅(A-Si)相比,多晶硅晶体更大,形状更规则,取向更均匀,因此多晶硅是目前通过表面微加工制造的微器件中使用最广泛的结构材料。多晶硅薄膜通常显示一个压缩的内置应变场。应变诊断结构用于阐明具有内置拉伸应变的多晶硅薄膜可以实现。我们已经报道了硼掺杂是一种间接应变测量方法,晶格间距变化可以用(Delta) a = a0 X (ri - rs/rs X (Ni/Ns))来模拟,其中ri和r2可以看作是杂质和硅原子的半径,Ni和Ns是杂质和硅的浓度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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