A new premolded packaging technology for low cost E/O device applications

Abstract

This paper describes a new premolded organic packaging technology for low cost E/O applications. This premolded packaging technology provides a low cost packaging option for E/O devices with high reliability was requirements. A reliability test method for premold technology was used to evaluate water penetration into the package cavity; it evaluates dew temperature after high temperature and high humidity storage. Measurement results indicate package performance very close to that of a ceramic package. This new low water penetration organic material has been developed to supply high reliability, low cost packaging technology to the E/O market. This paper proposes a design concept utilizing this premold material. The design includes an optical fiber pipe molded in the side wall of package.