Impact of substrate finish on Sn/Ag/Cu alloy solder joint

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396629

A. Anand, Y. Mui, J. Weidier, N. Diaz

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引用次数: 9

Abstract

In recent years, implementation of lead-free solder in the electronic industry is gaining momentum. Lower processing temperature and reliability of a Sn/Ag/Cu alloy has made it a viable alternative and the industry is aligning towards this alloy. This work investigates impact of substrate finish on Sn/Ag/Cu alloy for ball grid array packages. The scope of This work includes study of lead-free alloy Sn/Ag/Cu, Sn/Ag & Sn/Cu, its interaction with substrate plating finish, intermetallic at substrate-ball interface, shear force and failure mode. The type of substrate used in this study is buildup substrate with electroless nickel gold finish and laminate substrate with electrolytic nickel gold finish. Experimental results show that copper containing alloys exhibited failure mode at IMC/nickel interface, when shear test was performed on the units reflowed three times at 260deg. The conclusion from the above study is, Sn/Ag/Cu solder alloy used in ball grid array can result in fracture at IMC /electrolytic nickel interface. Impact force from testers or drop test can result in such brittle fracture between IMC and nickel. Increasing the copper percentage in Sn/Ag/Cu alloy can increase the chance of this brittle fracture between the IMC and electrolytic nickel interface.

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衬底光洁度对Sn/Ag/Cu合金焊点的影响

近年来，无铅焊料在电子行业的实施势头正猛。较低的加工温度和Sn/Ag/Cu合金的可靠性使其成为可行的替代方案，行业正在向这种合金靠拢。本文研究了球栅阵列封装中衬底光洁度对Sn/Ag/Cu合金的影响。本文主要研究了无铅合金Sn/Ag/Cu、Sn/Ag和Sn/Cu及其与基体镀层的相互作用、基体-球界面的金属间化合物、剪切力和破坏模式。本研究中使用的衬底类型为化学镀镍金堆焊衬底和电解镀镍金层压板。实验结果表明，在260°回流三次的剪切试验中，含铜合金在IMC/镍界面处呈现破坏模式。研究结果表明，采用Sn/Ag/Cu钎料合金制备球栅阵列会导致IMC /电解镍界面断裂。来自试验器的冲击力或跌落试验可导致IMC与镍之间的脆性断裂。增加Sn/Ag/Cu合金中铜的含量可以增加IMC与电解镍界面之间脆性断裂的几率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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