Bulk CMOS technology for SOC

C. H. Diaz
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引用次数: 1

Abstract

CMOS technology scaling has come to a point whereby traditional assumptions that warranted a fair degree of de-coupling between process development and circuit/system design do not hold. One specific example relates to chip standby leakage. Today's most advanced transistor designs push gate dielectric thickness into a regime where direct tunneling currents are no longer negligible. Meanwhile, the portable electronics sector had become a key industry driver demanding VLSI circuits with ever increasing functionality-performance needs while maintaining tight controls on power consumption. To conciliate the scaling-driven technology fundamental limitations with the industry evolution requirements, flexible CMOS technologies and tighter interaction between process development and circuit/system design are needed to efficiently realize Systems on a Chip (SoC). This paper discusses aspects of bulk CMOS SoC technology definition and front-end scaling trends.
SOC的批量CMOS技术
CMOS技术的扩展已经达到了这样一个地步,即传统的假设保证了工艺开发和电路/系统设计之间的公平程度的解耦不成立。一个具体的例子涉及芯片待机泄漏。今天最先进的晶体管设计推动栅极介电厚度到一个制度,直接隧道电流不再是微不足道的。与此同时,便携式电子行业已经成为一个关键的行业驱动因素,要求VLSI电路具有不断增加的功能性能需求,同时保持对功耗的严格控制。为了协调规模驱动技术的基本限制与行业发展需求,需要灵活的CMOS技术以及工艺开发和电路/系统设计之间更紧密的交互,以有效地实现片上系统(SoC)。本文讨论了批量CMOS SoC技术的定义和前端缩放趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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