H. Schroder, Norbert Arndt-Staufenbiel, L. Brusberg
{"title":"“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules","authors":"H. Schroder, Norbert Arndt-Staufenbiel, L. Brusberg","doi":"10.1109/ESTC.2008.4684532","DOIUrl":null,"url":null,"abstract":"The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 2nd Electronics System-Integration Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2008.4684532","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.