A. Khakifirooz, K. Cheng, T. Nagumo, N. Loubet, T. Adam, A. Reznicek, J. Kuss, D. Shahrjerdi, R. Sreenivasan, S. Ponoth, H. He, P. Kulkarni, Q. Liu, P. Hashemi, P. Khare, S. Luning, S. Mehta, J. Gimbert, Y. Zhu, Z. Zhu, J. Li, A. Madan, T. Levin, F. Monsieur, T. Yamamoto, S. Naczas, S. Schmitz, S. Holmes, C. Aulnette, N. Daval, W. Schwarzenbach, B. Nguyen, V. Paruchuri, M. Khare, G. Shahidi, B. Doris
{"title":"Strain engineered extremely thin SOI (ETSOI) for high-performance CMOS","authors":"A. Khakifirooz, K. Cheng, T. Nagumo, N. Loubet, T. Adam, A. Reznicek, J. Kuss, D. Shahrjerdi, R. Sreenivasan, S. Ponoth, H. He, P. Kulkarni, Q. Liu, P. Hashemi, P. Khare, S. Luning, S. Mehta, J. Gimbert, Y. Zhu, Z. Zhu, J. Li, A. Madan, T. Levin, F. Monsieur, T. Yamamoto, S. Naczas, S. Schmitz, S. Holmes, C. Aulnette, N. Daval, W. Schwarzenbach, B. Nguyen, V. Paruchuri, M. Khare, G. Shahidi, B. Doris","doi":"10.1109/VLSIT.2012.6242489","DOIUrl":null,"url":null,"abstract":"High-performance strain-engineered ETSOI devices are reported. Three methods to boost the performance, namely contact strain, strained SOI (SSDOI) for NFET, and SiGe-on-insulator (SGOI) for PFET are examined. Significant performance boost is demonstrated with competitive drive currents of 1.65mA/μm and 1.25mA/μm, and I<sub>eff</sub> of 0.95mA/μm and 0.70mA/μm at I<sub>off</sub> =100nA/μm and V<sub>DD</sub> of 1V, for NFET and PFET, respectively.","PeriodicalId":266298,"journal":{"name":"2012 Symposium on VLSI Technology (VLSIT)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Symposium on VLSI Technology (VLSIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2012.6242489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 33
Abstract
High-performance strain-engineered ETSOI devices are reported. Three methods to boost the performance, namely contact strain, strained SOI (SSDOI) for NFET, and SiGe-on-insulator (SGOI) for PFET are examined. Significant performance boost is demonstrated with competitive drive currents of 1.65mA/μm and 1.25mA/μm, and Ieff of 0.95mA/μm and 0.70mA/μm at Ioff =100nA/μm and VDD of 1V, for NFET and PFET, respectively.