{"title":"A New Type Low Cost Sandwiched Power Package Structure and its Manufacturing","authors":"Garry Ge, G. Lye, Sonder Wang, J. Zaal","doi":"10.1109/EPTC47984.2019.9026671","DOIUrl":null,"url":null,"abstract":"Now stacked die 3D package is much popular, especially for such power 3D package. For example, sometimes it designs control die stacking on power die; (refer to below package structure design) and control die apply thinner Cu wire bonding; but power die applies thicker Al wire bonding. This looks like conventional stacked dies design.","PeriodicalId":244618,"journal":{"name":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC47984.2019.9026671","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Now stacked die 3D package is much popular, especially for such power 3D package. For example, sometimes it designs control die stacking on power die; (refer to below package structure design) and control die apply thinner Cu wire bonding; but power die applies thicker Al wire bonding. This looks like conventional stacked dies design.