{"title":"Design considerations of scaled sub-0.1 /spl mu/m PD/SOI CMOS circuits","authors":"C. Chuang, R. Joshi, R. Puri, Keunwoo Kim","doi":"10.1109/ISQED.2003.1194724","DOIUrl":null,"url":null,"abstract":"This paper reviews the circuit design considerations of scaled sub-0.1 /spl mu/m partially-depleted SOI (PD/SOI) CMOS circuits for high-performance digital applications. The impact of technology/device scaling and design challenges are highlighted. Unique design aspects and issues resulting from the scaling of PD/SOI device structure, such as parasitic bipolar effect and reduced-V/sub T/ leakage, hysteretic V/sub T/ variation, low-voltage impact ionization, higher V/sub T,lin/ to maintain adequate V/sub T,sat/, scaling/thinning of Si film, gate-to-body tunneling current, self-heating, soft error rate (SER), and the introduction of strained-Si channel on SOI are addressed.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2003.1194724","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper reviews the circuit design considerations of scaled sub-0.1 /spl mu/m partially-depleted SOI (PD/SOI) CMOS circuits for high-performance digital applications. The impact of technology/device scaling and design challenges are highlighted. Unique design aspects and issues resulting from the scaling of PD/SOI device structure, such as parasitic bipolar effect and reduced-V/sub T/ leakage, hysteretic V/sub T/ variation, low-voltage impact ionization, higher V/sub T,lin/ to maintain adequate V/sub T,sat/, scaling/thinning of Si film, gate-to-body tunneling current, self-heating, soft error rate (SER), and the introduction of strained-Si channel on SOI are addressed.