Advanced Cu/Low-k BEOL Integration, Reliability, and Extendibility

Abstract

This talk will be a detailed discussion of technical aspects of Cu BEOL wiring that may be helpful or essential to preserve it successful migration path. The focus will be on BEOL architecture, integration techniques, their impact on reliability, and their outlooks for 32 nm. The talk will mainly call on new data produced by our Research and Development organizations and their associated alliances.