CMOS-compatible back-end process for in-plane actuating ferromagnetic MEMS

M. Glickman, P. Tseng, J. Harrison, I. Goldberg, Peter Johnson, P. Smeys, T. Niblock, J. Judy
{"title":"CMOS-compatible back-end process for in-plane actuating ferromagnetic MEMS","authors":"M. Glickman, P. Tseng, J. Harrison, I. Goldberg, Peter Johnson, P. Smeys, T. Niblock, J. Judy","doi":"10.1109/SENSOR.2009.5285516","DOIUrl":null,"url":null,"abstract":"We have designed, fabricated, and tested in-plane actuating ferromagnetic MEMS switches and solenoidal inductors, which were produced using a CMOS-compatible back-end process. This process creates compact high-performance devices without high temperature processes (<; 400°C) or etching into the plane of the wafer.","PeriodicalId":247826,"journal":{"name":"TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"154 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2009.5285516","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

We have designed, fabricated, and tested in-plane actuating ferromagnetic MEMS switches and solenoidal inductors, which were produced using a CMOS-compatible back-end process. This process creates compact high-performance devices without high temperature processes (<; 400°C) or etching into the plane of the wafer.
平面内驱动铁磁MEMS的cmos兼容后端工艺
我们设计,制造和测试了平面内驱动铁磁MEMS开关和螺线管电感器,它们是使用cmos兼容的后端工艺生产的。该工艺创造了紧凑的高性能器件,无需高温工艺(<;400°C)或蚀刻到晶圆片的平面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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