Soldering Material Evolution for Heterogeneous Integration

Abstract

Heterogeneous integration is the solution for advanced packaging by packing more dies or components into smaller footprints. This entire packaging evolution requires multiple technology breakthroughs in different aspects such as substrate design, interconnect methods, and materials. This paper will outline the trends in various soldering materials technology which cater to heterogeneous integration such as solder pastes, flip-chip fluxes, and ball-attach fluxes.