Power delivery design for 800MHz DDR2 memory systems in low-cost wire-bond packages

R. Schmitt, Joong-Ho Kim, D. Oh, C. Yuan
{"title":"Power delivery design for 800MHz DDR2 memory systems in low-cost wire-bond packages","authors":"R. Schmitt, Joong-Ho Kim, D. Oh, C. Yuan","doi":"10.1109/ECTC.2006.1645651","DOIUrl":null,"url":null,"abstract":"This paper describes the challenges in designing supply networks of high-speed interface systems in low-cost wire-bond packages. It introduces a set of figure-of-merits for the supply noise performance of interface systems. It then demonstrates how these parameters can be used to guide the design and verification of interface power distribution networks","PeriodicalId":194969,"journal":{"name":"56th Electronic Components and Technology Conference 2006","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"56th Electronic Components and Technology Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2006.1645651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

This paper describes the challenges in designing supply networks of high-speed interface systems in low-cost wire-bond packages. It introduces a set of figure-of-merits for the supply noise performance of interface systems. It then demonstrates how these parameters can be used to guide the design and verification of interface power distribution networks
低成本线键合封装800MHz DDR2存储系统的电源传输设计
本文描述了在低成本线键合封装中设计高速接口系统供应网络所面临的挑战。介绍了一套接口系统供电噪声性能的优劣图。然后演示了如何使用这些参数来指导接口配电网的设计和验证
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