{"title":"Power delivery design for 800MHz DDR2 memory systems in low-cost wire-bond packages","authors":"R. Schmitt, Joong-Ho Kim, D. Oh, C. Yuan","doi":"10.1109/ECTC.2006.1645651","DOIUrl":null,"url":null,"abstract":"This paper describes the challenges in designing supply networks of high-speed interface systems in low-cost wire-bond packages. It introduces a set of figure-of-merits for the supply noise performance of interface systems. It then demonstrates how these parameters can be used to guide the design and verification of interface power distribution networks","PeriodicalId":194969,"journal":{"name":"56th Electronic Components and Technology Conference 2006","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"56th Electronic Components and Technology Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2006.1645651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This paper describes the challenges in designing supply networks of high-speed interface systems in low-cost wire-bond packages. It introduces a set of figure-of-merits for the supply noise performance of interface systems. It then demonstrates how these parameters can be used to guide the design and verification of interface power distribution networks