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Effect of initial conditions on uniformity of metal assisted chemical etch for ultra-high aspect ratio, taper-free silicon nanostructures

Advanced Etch Technology and Process Integration for Nanopatterning XI Pub Date : 2022-04-25 DOI:10.1117/12.2604283
Akhila Mallavarapu, Mark Hrdy, Mariana Castañeda, P. Ajay, S. V. Sreenivasan
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初始条件对超高宽高比无锥度硅纳米结构金属辅助化学蚀刻均匀性的影响
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Advanced Etch Technology and Process Integration for Nanopatterning XI
Advanced Etch Technology and Process Integration for Nanopatterning XI
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