T. Brunschwiler, G. Schlottig, C. L. Ong, B. Burg, A. Sridhar
{"title":"On the Thermal Management of\n 3D\n ‐\n ICs\n : From Backside to Volumetric Heat Removal","authors":"T. Brunschwiler, G. Schlottig, C. L. Ong, B. Burg, A. Sridhar","doi":"10.1002/9783527697052.CH19","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Handbook of 3D Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527697052.CH19","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}