High performance metal/insulator/metal capacitors using HfTiO as dielectric

H. Hsu, Chun‐Hu Cheng, B. Tsui
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引用次数: 4

Abstract

Hafnium titanate (HfTiO) film was adapted as the insulator of MIM capacitors for RF/Analog ICs applications. Low leakage current of 3.4×10−8 A/cm2 at −1V and high capacitance density of 17.5fF/µm2 were obtained. A N2-plasma treatment on HfTiO films can further reduce leakage current by two orders of magnitude and no apparent degradation is observed on the capacitance density and voltage coefficient of capacitance (VCC) properties. Capacitance density of 5.1fF/µm2, leakage current of 1.3×10−9A/cm2, and parabolic VCC value of 40ppm/V2 can be achieved by 51nm thick HfTiO film. These results meet the RF/analog requirements in 2012 predicted by ITRS.
高性能金属/绝缘体/金属电容器采用HfTiO作为电介质
采用钛酸铪(HfTiO)薄膜作为射频/模拟集成电路中MIM电容器的绝缘体。在−1V时,获得了3.4×10−8 A/cm2的低漏电流和17.5fF/µm2的高电容密度。氮气等离子体处理可使泄漏电流进一步降低两个数量级,而电容密度和电容电压系数(VCC)性能没有明显下降。采用51nm厚的HfTiO薄膜,电容密度为5.1fF/µm2,漏电流为1.3×10−9A/cm2,抛物VCC值为40ppm/V2。这些结果满足了ITRS预测的2012年射频/模拟需求。
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