High temperature resistant Ni-Sn transient liquid phase sintering bonding for new generation semiconductor power electronic devices

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI:10.1109/EPTC.2015.7412388

Hongliang Feng, Jihua Huang, J Zhang, Xiaodong Zhai, Xingke Zhao, Shuhai Chen

{"title":"High temperature resistant Ni-Sn transient liquid phase sintering bonding for new generation semiconductor power electronic devices","authors":"Hongliang Feng, Jihua Huang, J Zhang, Xiaodong Zhai, Xingke Zhao, Shuhai Chen","doi":"10.1109/EPTC.2015.7412388","DOIUrl":null,"url":null,"abstract":"This paper presents the microstructural evolution of a Niekel-Tin(Ni-Sn) TLPS process. Ni-Sn power mixture was assembled in a Ni/Ni-Sn/Ni sandwiched structure and sintered in a vacuum furnace using different times at 340°C. The results show that after 180min with slight pressure of 0.1MPa the majority of Sn and Ni in the joint have completely formed intermetallic compounds(IMC) and the jointing layers mainly consists of Ni3Sn4, but not dense enough. With the increase of processing time, a dense microstructure can be observed after 300min. Microstructural characterization revealed the formation joints governed by the interdiffusion of the main constituents. The differential scanning calorimetry(DSC) profiles also show that the melting endothermic peak corresponding to Sn is negligible after 180min at 340°C and the melting event corresponding to the Ni3Sn4 occurs at approximate 798.9°C. Compared to the traditional solding technique, a higher temperature resistance bonding joint can be achieved using the Ni-Sn TLPS bonding at lower bonding temperature.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412388","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

Abstract

This paper presents the microstructural evolution of a Niekel-Tin(Ni-Sn) TLPS process. Ni-Sn power mixture was assembled in a Ni/Ni-Sn/Ni sandwiched structure and sintered in a vacuum furnace using different times at 340°C. The results show that after 180min with slight pressure of 0.1MPa the majority of Sn and Ni in the joint have completely formed intermetallic compounds(IMC) and the jointing layers mainly consists of Ni3Sn4, but not dense enough. With the increase of processing time, a dense microstructure can be observed after 300min. Microstructural characterization revealed the formation joints governed by the interdiffusion of the main constituents. The differential scanning calorimetry(DSC) profiles also show that the melting endothermic peak corresponding to Sn is negligible after 180min at 340°C and the melting event corresponding to the Ni3Sn4 occurs at approximate 798.9°C. Compared to the traditional solding technique, a higher temperature resistance bonding joint can be achieved using the Ni-Sn TLPS bonding at lower bonding temperature.

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新一代半导体电力电子器件耐高温镍锡瞬态液相烧结键合

本文介绍了镍锡(Ni-Sn) TLPS过程的显微组织演变。采用Ni/Ni- sn /Ni夹层结构组装Ni- sn粉末混合物，在340℃真空炉中采用不同时间进行烧结。结果表明:在0.1MPa的微压力下，180min后，接头中的大部分Sn和Ni已完全形成金属间化合物(IMC)，接头层主要由Ni3Sn4组成，但密度不够;随着加工时间的增加，300min后可以观察到致密的微观组织。显微组织表征表明，主要成分的相互扩散控制了形成接头。差示扫描量热(DSC)谱图还表明，在340℃下180min后，Sn对应的熔化吸热峰可以忽略不计，Ni3Sn4对应的熔化事件发生在798.9℃左右。与传统的焊接技术相比，在较低的焊接温度下，使用Ni-Sn TLPS焊接可以获得更高的耐高温焊接接头。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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