CAD flow for system on chip

P. Foulon
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引用次数: 0

Abstract

The introduction of very high deep sub-micron technology introduces a lot of new problems due to the increase in complexity. In order to handle huge chips containing 40-50 millions of transistors gathered in 30-40 blocks (commonly named IPs), multi clock domains, multi powered analog blocks, routed on 6 metal layers with some wire length measuring up to 3 cm, a hierarchical approach must be set up focusing on verification and timing closure. The author considers the following aspects of the problem: timing, data structures, top-down methodology, design teams, RTL quality, logic design standardization, DFT rules, formal proof, system verification, timing block level sign-off, and physical sign-off.
片上系统的CAD流程
极高深亚微米技术的引入,由于复杂性的增加,带来了许多新的问题。为了处理包含40- 5000万个晶体管的巨大芯片,这些晶体管聚集在30-40个块(通常称为ip)、多时钟域、多电源模拟块上,在6个金属层上布线,一些电线长度可达3厘米,必须建立一个分层方法,重点是验证和定时关闭。作者考虑了问题的以下几个方面:时序、数据结构、自顶向下的方法、设计团队、RTL质量、逻辑设计标准化、DFT规则、正式证明、系统验证、时序块级签名和物理签名。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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