Redefining IC packages with super-thin Substrates

Abstract

In an industry which demands for continuous innovation and perfection, we are constantly deriving new processes and solutions to break the technological limits which will set us apart. We are striving to achieve denser integrated circuits for better performance as Moore's law perceives and also redefining the word, “Thin”. Driven by cost and in order to achieve thinner IC packages, we have created an innovative solution which enables us to produce ultra-thin substrates. This technology allows us to make use of conventional materials such as PICs(photo imagable coverlay) and merging them with substrates to create products as thin as 25um. Our aim is to showcase the advantages of our Super-thin substrates versus the Molded interconnect substrates in terms of process and capability. This project is done and carried out in QDOS Interconnect.