Failure analysis of power integrated modules and its challenges

Abstract

Power Integrated Module (PIM) in a configurable package platform employs high-power direct-bonded-copper (DBC) substrate technology along with press-fit pins, thus, provides a high performance and reliable power module solution. The state of the art module platform however, presents a challenge to perform component-level failure analysis. The failure analysis techniques developed for multi-layered module packaging is presented in this paper.