Experimental Study of Single-Phase Cooling with DI Water in An Embedded Microchannels-3D Manifold Cooler

Abstract

We report on an advanced cooling Embedded Microchannels-3D Manifold $\mu$-Cooler (EMMC) capable of removing heat fluxes ∼1 kW/cm2, at a junction temperature ∼ 100–120 °C, with thermal resistance of ∼0.1 cm2-K/W, and pressure drop up to 8.4 kPa at flow rate of 200 g/min using single-phase DI water at the inlet temperature of 25 °C. The proposed EMMC design consists of two substrates: a microchannel cold-plate that is etched in to the silicon chip, and a fluid-routing silicon-based 3D manifold that delivers the cold liquid and extracts the hot fluid from the microprocessor. The EMMC consists of 25 parallel microchannels with a cross-sectional area of $75 \times 150\ \mu \mathrm{m}^{2}$ that are embedded into the cold-plate. The fluid-routing manifold bonded to the cold-plate has four inlet and five outlet conduits with channel heights of 700 and $1000\ \mu \mathrm{m}$, respectively. A gold serpentine heater is defined in a 52 mm2 of hotspot area located at the center of the cold-plate top surface that supplied heat fluxes from 50 to 900 W/cm2. The heated surface temperature is monitored by Infrared (IR) camera in real-time along with the electrical resistance thermometry.