A TDC-based test platform for dynamic circuit aging characterization

Min Chen, V. Reddy, J. Carulli, S. Krishnan, V. Rentala, V. Srinivasan, Yu Cao
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引用次数: 21

Abstract

An on-chip 45nm test platform that directly monitors circuit performance degradation during dynamic operation is demonstrated. In contrast to traditional ring-oscillator (RO) based frequency measurements, it utilizes a Time-to-Digital Converter (TDC) with 2ps resolution to efficiently monitor circuit delay change on-the-fly. This new technique allows the capability of measuring signal edge degradation under various realistic circuit operating scenarios, such as asymmetric aging, dynamic voltage/frequency scaling, dynamic duty cycle factors, and temperature variations.
基于tdc的动态电路老化特性测试平台
演示了在动态运行过程中直接监测电路性能下降的片上45nm测试平台。与传统的基于环振荡器(RO)的频率测量相比,它利用2ps分辨率的时间-数字转换器(TDC)有效地监测电路延迟变化。这项新技术允许在各种实际电路工作场景下测量信号边缘退化的能力,例如不对称老化,动态电压/频率缩放,动态占空比因子和温度变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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